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Heat Transfer due to Microscale Thin Film Evaporation From the Steady State Meniscus in a Coherent Porous Silicon Based Micro-Columnated Wicking Structure

[+] Author Affiliations
Navdeep S. Dhillon, Jim C. Cheng, Albert P. Pisano

University of California, Berkeley, Berkeley, CA

Paper No. IMECE2011-65057, pp. 667-677; 11 pages
  • ASME 2011 International Mechanical Engineering Congress and Exposition
  • Volume 10: Heat and Mass Transport Processes, Parts A and B
  • Denver, Colorado, USA, November 11–17, 2011
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5496-9
  • Copyright © 2011 by ASME


A numerical fluid flow and heat transfer model is presented in order to study the evaporation characteristics of a stationary thin film liquid-vapor meniscus. The model is used to evaluate the evaporative heat transfer performance of micron-size rectangular channels on the surface of the secondary wick, inside a micro-columnated coherent porous silicon wick design. The shape of the liquid-vapor meniscus in the channel is obtained by solving the Young-Laplace equation, using a surface energy minimizing algorithm. Mass, momentum and energy equations are then solved in the liquid domain using a discrete finite volume method-based approach. The vapor is assumed to be fully saturated and evaporation at the liquid-vapor interface is modeled using kinetic theory. The effect of wall superheat and inlet-liquid subcooling on the rate of evaporation and associated heat transfer from the evaporating meniscus is characterized.

Copyright © 2011 by ASME



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